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HMC736LP4 Datasheet(PDF) 4 Page - Hittite Microwave Corporation |
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HMC736LP4 Datasheet(HTML) 4 Page - Hittite Microwave Corporation |
4 / 6 page For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 8 8 - 4 Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. HMC736LP4 / 736LP4E v01.0209 MMIC VCO w/ HALF FREQUENCY OUTPUT 14.5 - 15.0 GHz Application Circuit |
Similar Part No. - HMC736LP4_10 |
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Similar Description - HMC736LP4_10 |
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