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SSG4403 Datasheet(PDF) 1 Page - SeCoS Halbleitertechnologie GmbH

Part # SSG4403
Description  P-Ch Enhancement Mode Power MOSFET
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Manufacturer  SECOS [SeCoS Halbleitertechnologie GmbH]
Direct Link  http://www.secosgmbh.com
Logo SECOS - SeCoS Halbleitertechnologie GmbH

SSG4403 Datasheet(HTML) 1 Page - SeCoS Halbleitertechnologie GmbH

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Elektronische Bauelemente
SSG4403
P-Ch Enhancement Mode Power MOSFET
-6.1 A, -30 V, RDS(ON) 50 mΩ
29-Oct-2009 Rev. B
Page 1 of 3
A
H
B
M
D
C
J
K
F
L
E
N
G
4403SC
1
S
S
S
G
D
D
D
D
= Date Code
2
3
4
5
6
7
8
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
The SSG4403 uses advanced trench technology
to provide excellent on-resistance, low gate charge and
operation with gate voltages as low as 2.5V.
The device is suitable for use as a load switch or
in PWM applications.
FEATURES
Low Gate Charge
Lower On-resistance
Fast Switching Characteristic
PACKAGE DIMENSIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATINGS
UNIT
Drain-Source Voltage
VDS
-30
V
Gate-Source Voltage
VGS
±12
V
Continuous Drain Current
3
ID @Ta=25℃
-6.1
A
Continuous Drain Current
3
ID @Ta=70℃
-5.1
A
Pulsed Drain Current
1
IDM
-60
A
Total Power Dissipation
PD @Ta=25℃
2.5
W
Linear Derating Factor
0.02
W/℃
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 ~ +150
THERMAL DATA
Thermal Resistance Junction-ambient
3
Max.
Rθj-amb
50
℃/W
P-CHANNEL ELECTRICAL CHARACTERISTICS (Tj = 25°C unless otherwise specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITIONS
Drain-Source Breakdown Voltage
BVDSS
-30
-
-
V
VGS=0, ID=-250µA
Gate Threshold Voltage
VGS(th)
-0.7
-
-1.3
V
VDS=VGS, ID=-250µA
Forward Transconductance
gfs
-
11
-
S
VDS=-5V, ID=-5A
Gate-Source Leakage Current
IGSS
-
-
±100
nA
VGS= ±12V
Drain-Source Leakage Current(Tj=25℃)
-
-
-1
µA
VDS=-30V, VGS=0
Drain-Source Leakage Current(Tj=55℃)
IDSS
-
-
-5
µA
VDS=-24V, VGS=0
-
-
50
VGS=-10V, ID=-6.1A
-
-
61
VGS=-4.5V, ID=-5A
Static Drain-Source On-Resistance
2
RDS(ON)
-
-
117
m
VGS=-2.5 V, ID=-1 A
Total Gate Charge
2
Qg
-
9.4
-
Gate-Source Charge
Qgs
-
2
-
Gate-Drain (“Miller”) Change
Qgd
-
3
-
nC
ID=-5 A
VDS=-15 V
VGS=-4.5 V
Turn-on Delay Time
2
Td(on)
-
7.6
-
Rise Time
Tr
-
8.6
-
Turn-off Delay Time
Td(off)
-
44.7
-
Fall Time
Tf
-
16.5
-
ns
VDS=-15 V
ID=-10 V
RG=6
RL=2.4
Input Capacitance
Ciss
-
940
-
Output Capacitance
Coss
-
104
-
Reverse Transfer Capacitance
Crss
-
73
-
pF
VGS=0 V
VDS=-15 V
f=1.0 MHz
SOURCE-DRAIN DIODE
Forward On Voltage
2
VSD
-
-
-1.0
V
IS=-1A, VGS=0 V
Continuous Source Current (Body Diode)
IS
-
-
-4.2
A
Reverse Recovery Time
2
Trr
-
22.7
-
ns
Reverse Recovery Charge
Qrr
-
15.9
-
nC
IS = -5A, VGS = 0V,
dl/dt = 100A/µs
Notes:
1. Pulse width limited by Max. junction temperature.
2. Pulse width≦300µs, duty cycle≦2%.
3. Surface Mounted on 1 in
2 copper pad of FR4 board; 125 °C/W when mounted on Min. copper pad.
SOP-8
Millimeter
Millimeter
REF.
Min.
Max.
REF.
Min.
Max.
A
5.80
6.20
H
0.35
0.49
B
4.80
5.00
J
0.375 REF.
C
3.80
4.00
K
45°
D
L
1.35
1.75
E
0.40
0.90
M
0.10
0.25
F
0.19
0.25
N
0.25 REF.
G
1.27 TYP.
Source
Drain
Gate


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