NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.30mm FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C

A

SEATING

PLANE

D

E

0.10 C

A3

A

A1

2X

2X

0.10 C

WDFN6 1.5x1.5, 0.5P

CASE 511BJ−01

ISSUE B

DATE 06 JUL 2010

SCALE 4:1

DIM

A

MIN

MAX

MILLIMETERS

0.70

0.80

A1

0.00

0.05

A3

0.20 REF

b

0.20

0.30

D

E

e

L

PIN ONE

REFERENCE

0.05 C

0.05 C

A

0.10 C

NOTE 3

L2

e

b

B

3

6

6X

1

4

0.05 C

MOUNTING FOOTPRINT*

L1

1.50 BSC

1.50 BSC

0.50 BSC

0.40

0.60

---

0.15

GENERIC

MARKING DIAGRAM*

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

BOTTOM VIEW

L

5X

DIMENSIONS: MILLIMETERS

0.73

6X

0.35

5X

1.80

0.50

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

A1

A3

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL B

DETAIL A

L2

0.50

0.70

TOP VIEW

B

SIDE VIEW

NOTE 4

RECOMMENDED

0.83

X

= Specific Device Code

M

= Date Code

G

= Pb−Free Package

X MG

G

1

(Note: Microdot may be in either location)

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

http://onsemi.com

1

© Semiconductor Components Industries, LLC, 2002

October, 2002 − Rev. 0

Case Outline Number:

XXX

DOCUMENT NUMBER:

STATUS:

NEW STANDARD:

DESCRIPTION:

98AON50296E

ON SEMICONDUCTOR STANDARD

WDFN6, 1.5 X 1.5, 0.5 P

Electronic versions are uncontrolled except when

accessed directly from the Document Repository. Printed

versions are uncontrolled except when stamped

“CONTROLLED COPY” in red.

PAGE 1 OF 2