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SC16IS740 Datasheet(PDF) 56 Page - NXP Semiconductors |
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SC16IS740 Datasheet(HTML) 56 Page - NXP Semiconductors |
56 / 63 page SC16IS740_750_760 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 7 — 9 June 2011 56 of 63 NXP Semiconductors SC16IS740/750/760 Single UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR Fig 44. Package outline SOT355-1 (TSSOP24) UNIT A1 A2 A3 bp cD(1) E(2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M b p Z e 112 24 13 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A D y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1 |
Similar Part No. - SC16IS740_11 |
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Similar Description - SC16IS740_11 |
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