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SC16IS740 Datasheet(PDF) 55 Page - NXP Semiconductors |
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SC16IS740 Datasheet(HTML) 55 Page - NXP Semiconductors |
55 / 63 page SC16IS740_750_760 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 7 — 9 June 2011 55 of 63 NXP Semiconductors SC16IS740/750/760 Single UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR Fig 43. Package outline SOT616-3 (HVQFN24) 0.5 1 0.2 A1 Eh b UNIT y e REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.1 3.9 Dh 2.75 2.45 y1 4.1 3.9 2.75 2.45 e1 2.5 e2 2.5 0.30 0.18 c 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT616-3 MO-220 04-11-19 05-03-10 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT616-3 HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 712 24 19 18 13 6 1 X D E C B A e2 terminal 1 index area terminal 1 index area A C C B v M w M 1/2 e 1/2 e E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
Similar Part No. - SC16IS740_11 |
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Similar Description - SC16IS740_11 |
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