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AT24C32D Datasheet(PDF) 21 Page - ATMEL Corporation |
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AT24C32D Datasheet(HTML) 21 Page - ATMEL Corporation |
21 / 26 page 21 8717B–SEEPR–6/10 Atmel AT24C32D/64D 8Y6 – MLP Package Drawing Contact: packagedrawings@atmel.com DRAWING NO. GPC REV. TITLE 8Y6 YNZ E 11/21/08 8Y6, 8-lead, 2.0x3.0mm Body, 0.50mm Pitch, UltraThin Mini-MAP, Dual No Lead Package (Sawn)(UDFN) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE 1.40 – – 0.00 – 0.20 0.20 D E D2 E2 A A1 A2 A3 L e b 2.00 BSC 3.00 BSC 1.50 – – 0.02 – 0.20 REF 0.30 0.50 BSC 0.25 1.60 1.40 0.60 0.05 0.55 0.40 0.30 2 A2 Pin 1 Index Area A3 D b (8X) Pin 1 ID A1 A L (8X) e (6X) 1.50 REF. D2 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground |
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