20

8717B–SEEPR–6/10

Atmel AT24C32D/64D

8A2 – TSSOP

Package Drawing Contact:

packagedrawings@atmel.com

DRAWING NO.

REV.

TITLE

GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

D

2.90

3.00

3.10

2, 5

E

6.40 BSC

E1

4.30

4.40

4.50

3, 5

A

–

–

1.20

A2

0.80

1.00

1.05

b

0.19

–

0.30

4

e

0.65 BSC

L

0.45

0.60

0.75

L1

1.00 REF

Side View

End View

Top View

A2

A

L

L1

D

1

2

3

E1

N

b

Pin 1 indicator

this corner

E

e

Notes:

1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions,

tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall

not exceed 0.15mm (0.006in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed

0.25mm (0.010in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess

of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.

Minimum space between protrusion and adjacent lead is 0.07mm.

5. Dimension D and E1 to be determined at Datum Plane H.

8A2

E

5/19/10

8A2, 8-lead 4.4mm Body, Plastic Thin

Shrink Small Outline Package (TSSOP)

TNR