■

Portable memory

■

LCD monitors

■

Disk drives

■

PDAs

■

Digital cameras

■

DVDs

■

Cell phones

■

Rechargeable battery packs

■

Battery chargers

■

Set top boxes

■

Industrial controllers

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

SF-0402F Series - Fast Acting Surface Mount Fuses

Solder Reflow Recommendations

Peak: 250 +0/-5 °C

230 °C or higher

PRE-HEATING ZONE

SOLDERING ZONE

HEATING TIME

180 °C

250

200

150

100

50

150 °C

90 ± 30 Seconds

30 ± 10 Seconds

PEAK: 250 +0/-5 °C, 5 seconds

PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds

SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds

Product Dimensions

Recommended Pad Layout

1.0 ± 0.1

(.039 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.2 ± 0.1

(.008 ± .004)

0.52 ± 0.05

(.020 ± .002)

0.25 ± 0.1

(.010 ± .004)

0.25 ± 0.1

(.010 ± .004)

0.35 ± 0.05

(.014 ± .002)

DIMENSIONS:

MM

(INCHES)

Thermal Derating Curve

120

110

100

90

80

-20

0

20

40

AMBIENT TEMPERATURE (°C)

60

80

100

120

Construction & Material Content

OVERCOAT

Sn PLATING

CERAMIC SUBSTRATE

FUSE ELEMENT

Cu / Ni PLATING

0.558

(.022)

1.55

(.061)

0.381

(.015)

PACKAGING: 10,000 pcs./reel