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313079-001 Datasheet(PDF) 4 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 4 Page - Intel Corporation |
4 / 104 page ![]() 4 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 6.2.6 Tcontrol and Fan Speed Reduction ............................................................79 6.2.7 Thermal Diode........................................................................................79 7 Features ....................................................................................................................83 7.1 Power-On Configuration Options ..........................................................................83 7.2 Clock Control and Low Power States.....................................................................83 7.2.1 Normal State .........................................................................................84 7.2.2 HALT or Enhanced Powerdown States ........................................................84 7.2.3 Stop-Grant State ....................................................................................85 7.2.4 Enhanced HALT Snoop or HALT Snoop State, Stop Grant Snoop State...........................................................................86 7.3 Enhanced Intel SpeedStep® Technology...............................................................86 8 Boxed Processor Specifications .....................................................................................89 8.1 Introduction......................................................................................................89 8.2 Mechanical Specifications....................................................................................90 8.2.1 Boxed Processor Heat Sink Dimensions (CEK).............................................91 8.2.2 Boxed Processor Heat Sink Weight ............................................................99 8.2.3 Boxed Processor Retention Mechanism and Heat Sink Support (CEK) .........................................................................99 8.3 Electrical Requirements ......................................................................................99 8.3.1 Fan Power Supply (Active CEK).................................................................99 8.3.2 Boxed Processor Cooling Requirements.................................................... 100 8.4 Boxed Processor Contents................................................................................. 101 9 Debug Tools Specifications ......................................................................................... 103 9.1 Debug Port System Requirements ...................................................................... 103 9.2 Target System Implementation.......................................................................... 103 9.2.1 System Implementation......................................................................... 103 9.3 Logic Analyzer Interface (LAI) .......................................................................... 103 9.3.1 Mechanical Considerations ..................................................................... 104 9.3.2 Electrical Considerations ........................................................................ 104 Figures 2-1 Phase Lock Loop (PLL) Filter Requirements............................................................18 2-2 Dual-Core Intel® Xeon® Processor 5000 Series (1066 MHz) Load Current versus Time ...................................................................................27 2-3 Dual-Core Intel® Xeon® Processor 5000 Series (667 MHz) and Dual-Core Intel® Xeon® Processor 5063 (MV) Load Current versus Time..................28 2-4 VCC Static and Transient Tolerance Load Lines ......................................................29 2-5 VCC Overshoot Example Waveform ......................................................................32 3-1 Processor Package Assembly Sketch.....................................................................33 3-2 Processor Package Drawing (Sheet 1 of 3) ............................................................34 3-3 Processor Package Drawing (Sheet 2 of 3) ............................................................35 3-4 Processor Package Drawing (Sheet 3 of 3) ............................................................36 3-5 Dual-Core Intel Xeon Processor 5000 Series Top-side Markings................................39 3-6 Dual-Core Intel Xeon Processor 5063 (MV) Top-side Markings..................................39 3-7 Processor Land Coordinates, Top View ..................................................................40 3-8 Processor Land Coordinates, Bottom View .............................................................41 6-1 Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profiles A and B.....................................................................................71 6-2 Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profiles ...................73 6-3 Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile ......................................75 6-4 Case Temperature (TCASE) Measurement Location.................................................76 7-1 Stop Clock State Machine....................................................................................85 |
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