 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
313079-001 Datasheet(PDF) 38 Page - Intel Corporation |
|
|
|||||||||||||||||||||||||||||
313079-001 Datasheet(HTML) 38 Page - Intel Corporation |
|
|
38 / 104 page  Mechanical Specifications 38 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 10. R is defined as the radial distance from the center of the LGA771 socket ball array to the center of heatsink load reaction point closest to the socket. 11. Applies to populated sockets in fully populated and partially populated socket configurations. 12. Through life or product. Condition must be satisfied at the beginning of life and at the end of life. 13. Rigid back is not allowed. The board should flex in the enabled configuration. 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on a package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Notes: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. 2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface. 3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. 4. These guidelines are based on limited testing for design characterization and incidental applications (one time only). 5. Handling guidelines are for the package only and do not include the limits of the processor socket. 3.5 Package Insertion Specifications The Dual-Core Intel Xeon Processor 5000 Series can be inserted and removed 15 times from an LGA771 socket. 3.6 Processor Mass Specifications The typical mass of the Dual-Core Intel Xeon Processor 5000 series is 21.5 grams [0.76 oz.]. This includes all components which make up the entire processor product. 3.7 Processor Materials The Dual-Core Intel Xeon Processor 5000 series are assembled from several components. The basic material properties are described in Table 3-3. Table 3-2. Package Handling Guidelines Parameter Maximum Recommended Units Notes Shear 311 70 N lbf 1,4,5 Tensile 111 25 N lbf 2,4,5 Torque 3.95 35 N-m LBF-in 3,4,5 Table 3-3. Processor Materials Component Material Integrated Heat Spreader (IHS) Nickel over copper Substrate Fiber-reinforced resin Substrate Lands Gold over nickel |
Similar Part No. - 313079-001 |
|
Similar Description - 313079-001 |
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.COM |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
