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313079-001 Datasheet(PDF) 33 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 33 Page - Intel Corporation |
33 / 104 page ![]() Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 33 Mechanical Specifications 3 Mechanical Specifications The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The package consists of a processor core mounted on a pinless substrate with 771 lands. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the interface for processor component thermal solutions such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. . The package components shown in Figure 3-1 include the following: 1. Integrated Heat Spreader (IHS) 2. Thermal Interface Material (TIM) 3. Processor Core (die) 4. Package Substrate 5. Landside capacitors 6. Package Lands Note: This drawing is not to scale and is for reference only. 3.1 Package Mechanical Drawings The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings include dimensions necessary to design a thermal solution for the processor including: 1. Package reference and tolerance dimensions (total height, length, width, an so forth) 2. IHS parallelism and tilt 3. Land dimensions 4. Top-side and back-side component keepout dimensions 5. Reference datums Note: All drawing dimensions are in mm [in.]. Figure 3-1. Processor Package Assembly Sketch IHS Substrate LGA771 Socket System Board Capacitors Core (die) TIM Package Lands IHS Substrate LGA771 Socket System Board Capacitors Core (die) TIM Package Lands |
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