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313079-001 Datasheet(PDF) 25 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 25 Page - Intel Corporation |
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25 / 104 page  Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 25 Electrical Specifications Notes: 1. For functional operation, all processor electrical, signal quality, mechanical and thermal specifications must be satisfied. 2. Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined in Section 3. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor. 3. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long-term reliability of the device. For functional operation, please refer to the processor case temperature specifications. 4. This rating applies to the processor and does not include any tray or packaging. 5. Failure to adhere to this specification can affect the long term reliability of the processor. 2.12 Processor DC Specifications The processor DC specifications in this section are defined at the processor core (pads) unless noted otherwise. See Section 4.1 for the Dual-Core Intel Xeon Processor 5000 series land listings and Section 5.1 for signal definitions. Voltage and current specifications are detailed in Table 2-10. For platform planning refer to Table 2-11, which provides Voltage-Current projections. This same information is presented graphically in Figure 2-4. BSEL[2:0] and VID[5:0] signals are specified in Table 2-12. The DC specifications for the AGTL+ signals are listed in Table 2-13. Legacy signals and Test Access Port (TAP) signals follow DC specifications similar to GTL+. The DC specifications for the PWRGOOD input and TAP signal group are listed in Table 2-14 and the Asynchronous GTL+ signal group is listed in Table 2-15. The VTTPWRGD signal is detailed in Table 2-16. Table 2-10 through Table 2-16 list the DC specifications for the processor and are valid only while meeting specifications for case temperature (TCASE as specified in Table 6-1), clock frequency, and input voltages. Care should be taken to read all notes associated with each parameter. Table 2-10. Voltage and Current Specifications (Sheet 1 of 2) Symbol Parameter Min Typ Max Unit Notes 1,13 VID VID range 1.0750 1.3500 V VCC VCC for Dual-Core Intel Xeon Processor 5000 series core. FMB processor. See Table 2-11 and Figure 2-4 V 2, 3, 4, 6, 11 VVID_STEP VID step size during a transition ± 12.5 mV VVID_SHIFT Total allowable DC load line shift from VID steps 425 mV 12 VTT FSB termination voltage (DC + AC specification) 1.140 1.20 1.260 V 10, 14 ICC ICC for Dual-Core Intel Xeon Processor 5000 series with multiple VID (667 MHz) 115 A 4, 5, 6, 11 ICC ICC for Dual-Core Intel Xeon Processor 5000 series with multiple VID (1066 MHz) 150 A 4, 5, 6, 11 ICC ICC for Dual-Core Intel Xeon Processor 5063 (MV) with multiple VID 115 A 4, 5, 6, 11 ICC_RESET ICC_RESET for Dual-Core Intel Xeon Processor 5000 series with multiple VID (667 MHz) 115 A 18 |
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