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313079-001 Datasheet(PDF) 12 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 12 Page - Intel Corporation |
12 / 104 page ![]() Introduction 12 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet • Thermal Design Power – Processor thermal solutions should be designed to meet this target. It is the highest expected sustainable power while running known power intensive real applications. TDP is not the maximum power that the processor can dissipate. • LGA771 socket – The Dual-Core Intel Xeon Processor 5000 series interfaces to the baseboard through this surface mount, 771 Land socket. See the LGA771 Socket Design Guidelines for details regarding this socket. • Processor – A single package that contains one or more complete execution cores. • Processor core – Processor core die with integrated L2 cache. All AC timing and signal integrity specifications are at the pads of the processor core. • Intel® Virtualization Technology – Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform. • VRM (Voltage Regulator Module) – DC-DC converter built onto a module that interfaces with a card edge socket and supplies the correct voltage and current to the processor based on the logic state of the processor VID bits. • EVRD (Enterprise Voltage Regulator Down) – DC-DC converter integrated onto the system board that provides the correct voltage and current to the processor based on the logic state of the processor VID bits. • VCC – The processor core power supply. • VSS – The processor ground. • VTT – FSB termination voltage. 1.2 State of Data The data contained within this document is subject to change. It is the most accurate information available by the publication date of this document and is based on final silicon characterization. All specifications in this version of the Dual-Core Intel® Xeon® Processor 5000 Series Datasheet can be used for platform design purposes (layout studies, characterizing thermal capabilities, and so forth). 1.3 References Material and concepts available in the following documents may be beneficial when reading this document: Document Intel Order Number AP-485, Intel® Processor Identification and the CPUID Instruction 241618 IA-32 Intel® Architecture Software Developer's Manual • Volume 1: Basic Architecture • Volume 2A: Instruction Set Reference, A-M • Volume 2B: Instruction Set Reference, N-Z • Volume 3A: System Programming Guide • Volume 3B: System Programming Guide 253665 253666 253667 253668 253669 64-bit Extension Technology Software Developer's Guide • Volume 1 • Volume 2 300834 300835 IA-32 Intel® Architecture Optimization Reference Manual 248966 |
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