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313079-001 Datasheet(PDF) 100 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 100 Page - Intel Corporation |
100 / 104 page ![]() Boxed Processor Specifications 100 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power header identification and location must be documented in the suppliers platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 177.8 mm [7 in.] from the center of the processor socket. 8.3.2 Boxed Processor Cooling Requirements As previously stated the boxed processor will be available in two product configurations. Each configuration will require unique design considerations. Meeting the processor’s temperature specifications is also the function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specifications are found in Chapter 6, “Thermal Specifications” of this document. Table 8-1. PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution Description Min Frequency Nominal Frequency Max Frequency Unit PWM Control Frequency Range 21,000 25,000 28,000 Hz Table 8-2. Fan Specifications for 4-pin Active CEK Thermal Solution Description Min Typ Steady Max Steady Max Startup Unit +12 V: 12 volt fan power supply 10.8 12 12 13.2 V IC: Fan Current Draw N/A 1 1.25 1.5 A SENSE: SENSE frequency 2 2 2 2 Pulses per fan revolution Figure 8-11. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Table 8-3. Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution Pin Number Signal Color 1 Ground Black 2 Power: (+12 V) Yellow 3 Sense: 2 pulses per revolution Green 4 Control: 21 KHz-28 KHz Blue |
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