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313079-001 Datasheet(PDF) 89 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 89 Page - Intel Corporation |
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89 / 104 page  Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 89 Boxed Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel boxed processors are intended for system integrators who build systems from components available through distribution channels. The Dual-Core Intel® Xeon® Processor 5000 series will be offered as an Intel boxed processor. Intel will offer the Dual-Core Intel Xeon Processor 5000 series boxed processor with two heat sink configurations available for each processor frequency: 1U passive/2U active combination solution and a 2U passive only solution. The 1U passive/2U active combination solution is based on a 1U passive heat sink with a removable fan that will be pre-attached at shipping. This heat sink solution is intended to be used as either a 1U passive heat sink or a 2U+ active heat sink. Although the active combination solution with removable fan mechanically fits into a 2U keepout, additional design considerations may need to be addressed to provide sufficient airflow to the fan inlet. The 1U passive/2U active combination solution in the active fan configuration is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and strong side directional airflow is not an issue. The 1U passive/active combination solution with the fan removed and the 2U passive thermal solution require the use of chassis ducting and are targeted for use in rack mount servers. The retention solution used for these products is called the Common Enabling Kit, or CEK. The CEK base is compatible with both thermal solutions and uses the same hole locations as the Intel® Xeon® processor with 800 MHz FSB. The 1U passive/active combination solution will utilize a removable fan with a 4-pin pulse width modulated (PWM) T-diode control. Use of a 4-pin PWM T-diode controlled active thermal solution helps customers meet acoustic targets in pedestal platforms through the motherboards’s ability to directly control the RPM of the processor heat sink fan. Please see Section 8.3 for more details. Figure 8-1 through Figure 8-3 are representations of the two heat sink solutions. Figure 8-1. Boxed Dual-Core Intel Xeon Processor 5000 Series 1U Passive/2U Active Combination Heat Sink (With Removable Fan) |
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