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313079-001 Datasheet(PDF) 77 Page - Intel Corporation |
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313079-001 Datasheet(HTML) 77 Page - Intel Corporation |
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77 / 104 page  Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 77 Thermal Specifications 6.2 Processor Thermal Features 6.2.1 Thermal Monitor The Thermal Monitor (TM1) feature helps control the processor temperature by activating the Thermal Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power consumption as needed by modulating (starting and stopping) the internal processor core clocks. The Thermal Monitor (TM1) must be enabled for the processor to be operating within specifications. The temperature at which Thermal Monitor activates the thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active. When the Thermal Monitor is enabled and a high temperature situation exists (that is, TCC is active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (typically 30 -50%). Cycle times are processor speed dependent and will decrease as processor core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases. With a thermal solution designed to meet Thermal Profile A, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief periods of TCC activation is expected to be so minor that it would be immeasurable. A thermal solution that is designed to Thermal Profile B may cause a noticeable performance loss due to increased TCC activation. Thermal Solutions that exceed Thermal Profile B will exceed the maximum temperature specification and affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines for information on designing a thermal solution. The duty cycle for the TCC, when activated by the TM1, is factory configured and cannot be modified. The TM1 does not require any additional hardware, software drivers, or interrupt handling routines. 6.2.2 On-Demand Mode The processor provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as “On- Demand” mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems utilizing the Dual-Core Intel Xeon Processor 5000 series must not rely on software usage of this mechanism to limit the processor temperature. If bit 4 of the IA32_CLOCK_MODULATION MSR is set to a ‘1’, the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable via bits 3:1 of the same IA32_CLOCK_MODULATION MSR. In On-Demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor; however, if |
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