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313079-001 Datasheet(PDF) 72 Page - Intel Corporation

Part # 313079-001
Description  Dual-Core Intel Xeon Processor
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

313079-001 Datasheet(HTML) 72 Page - Intel Corporation

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Thermal Specifications
72
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
Notes:
1.
These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at
specified ICC. Please refer to the loadline specifications in Chapter 2, “Electrical Specifications.”
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum TCASE.
3.
These specifications are based on final silicon validation/characterization.
4.
Power specifications are defined at all VIDs found in Table 2-10. The Dual-Core Intel Xeon Processor 5000
series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-3.
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile B
Table
Power (W)
TCASE_MAX (° C)
Power (W)
TCASE_MAX (° C)
P_profile_min_B=22.3
50.0
80
65.0
30
52.0
85
66.3
35
53.3
90
67.6
40
54.6
95
68.9
45
55.9
100
70.2
50
57.2
105
71.5
55
58.5
110
72.8
60
59.8
115
74.1
65
61.1
120
75.4
70
62.4
125
76.7
75
63.7
130
78.0
Table 6-4.
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Specifications
Core Frequency
Thermal
Design Power
(W)
Minimum
TCASE
(°C)
Maximum TCASE
(°C)
Notes
Launch to FMB
95
5
Refer to Figure 6-2;
Table 6-5; Table 6-6
1, 2, 3, 4,
5


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