3.3V, 8Mb, Nonvolatile SRAM with Clock

14

Applications Information

Power-Supply Decoupling

To achieve the best results when using the device,

decouple the power supply with a 0.1FF capacitor.

Use a high-quality, ceramic, surface-mount capacitor

if possible. Surface-mount components minimize lead

inductance, which improves performance, and ceram-

ic capacitors tend to have adequate high-frequency

response for decoupling applications.

Avoiding Data Bus Contention

Care should be taken to avoid simultaneous access of

the SRAM and RTC devices (see Figure 2). Any chip-

and unpredictable behavior.

Recommended Cleaning Procedures

The device can be cleaned using aqueous-based clean-

ing solutions. No special precautions are needed when

cleaning boards containing a DS3065WP module, pro-

vided that the cleaning and subsequent drying process

is completed prior to the DS9034I-PCX+ attachment.

DS3065W modules are recognized by Underwriters

Laboratories (UL) under file E99151.

Package Information

For the latest package outline information and land patterns,

“-” in the package code indicates RoHS status only. Package

drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Figure 2. SRAM/RTC Data Bus Control

CE

CS

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

34 PCAP

—

21-0246

See the

outline no.

21-0246