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NTZS3151P Datasheet(PDF) 1 Page - ON Semiconductor |
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NTZS3151P Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 5 page ![]() © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 2 1 Publication Order Number: NTZS3151P/D NTZS3151P Small Signal MOSFET −20 V, −950 mA, P−Channel SOT−563 Features • Low RDS(on) Improving System Efficiency • Low Threshold Voltage • Small Footprint 1.6 x 1.6 mm • These are Pb−Free Devices Applications • Load/Power Switches • Battery Management • Cell Phones, Digital Cameras, PDAs, Pagers, etc. MAXIMUM RATINGS (TJ = 25°C unless otherwise noted.) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS −20 V Gate−to−Source Voltage VGS ±8.0 V Continuous Drain Current (Note 1) Steady State TA = 25°C ID −860 mA TA = 70°C −690 Power Dissipation (Note 1) Steady State PD 170 mW Continuous Drain Current (Note 1) t v 5 s TA = 25°C ID −950 mA TA = 70°C −760 Power Dissipation (Note 1) t v 5 s PD 210 mW Pulsed Drain Current tp = 10 ms IDM −4.0 A Operating Junction and Storage Temperature TJ, TSTG −55 to 150 °C Source Current (Body Diode) IS −360 mA Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit Junction−to−Ambient – Steady State (Note 1) RqJA 720 °C/W Junction−to−Ambient – t v 5 s (Note 1) RqJA 600 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surface−mounted on FR4 board using 1 in. sq. pad size (Cu. area = 1.127 in. sq. [1 oz.] including traces). SOT−563−6 CASE 463A MARKING DIAGRAM http://onsemi.com V(BR)DSS RDS(on) Typ ID Max −20 V 120 mW @ −4.5 V 144 mW @ −2.5 V −950 mA 195 mW @ −1.8 V 1 6 TX = Specific Device Code M = Date Code G = Pb−Free Package TX M G G Top View D D S D D 6 5 4 1 2 3 G PINOUT: SOT−563 D S G P−Channel MOSFET See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ORDERING INFORMATION (Note: Microdot may be in either location) |
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