NTZS3151P

http://onsemi.com

5

PACKAGE DIMENSIONS

DIM MIN

NOM

MAX

MILLIMETERS

A

0.50

0.55

0.60

b

0.17

0.22

0.27

C

D

1.50

1.60

1.70

E

1.10

1.20

1.30

e

0.5 BSC

L

0.10

0.20

0.30

1.50

1.60

1.70

0.020 0.021 0.023

0.007 0.009 0.011

0.059 0.062 0.066

0.043 0.047 0.051

0.02 BSC

0.004 0.008 0.012

0.059 0.062 0.066

MIN

NOM

MAX

INCHES

SOT−563, 6 LEAD

CASE 463A−01

ISSUE F

e

M

0.08 (0.003)

X

A

C

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE MATERIAL.

D

E

Y

12

3

4

5

L

6

1.35

0.0531

0.5

0.0197

mm

inches

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.08

0.12

0.18 0.003 0.005 0.007

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NTZS3151P/D

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