NA555, NE555, SA555, SE555

SLFS022H – SEPTEMBER 1973 – REVISED JUNE 2010

www.ti.com

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

18

V

Input voltage

CONT, RESET, THRES, TRIG

V

Output current

±225

mA

D package

97

P package

85

°C/W

PS package

95

PW package

149

FK package

5.61

°C/W

JG package

14.5

Operating virtual junction temperature

150

°C

Case temperature for 60 s

FK package

260

°C

Lead temperature 1, 6 mm (1/16 in) from case for 60 s

JG package

300

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND.

(3)

(4)

The package thermal impedance is calculated in accordance with JESD 51-7.

(5)

(6)

The package thermal impedance is calculated in accordance with MIL-STD-883.

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

NA555, NE555, SA555

4.5

16

Supply voltage

V

SE555

4.5

18

Input voltage

CONT, RESET, THRES, and TRIG

V

Output current

±200

mA

NA555

–40

105

NE555

0

70

Operating free-air temperature

°C

SA555

–40

85

SE555

–55

125

4

Submit Documentation Feedback

Copyright © 1973–2010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555