K4B2G0446C datasheet(15/23 Pages) SAMSUNG

Part #	K4B2G0446C

Description	DDR3 SDRAM Memory

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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Product Guide

DDR3 SDRAM Memory

May. 2010

78Ball DDP for 2Gb C-die (x4/x8)

78Ball for 4Gb A-die (x4/x8)

TOP VIEW

A

B

C

D

E

F

G

H

M

N

8.00

± 0.10

0.80 x 8 = 6.40

3.20

0.80

78 -

∅0.45 Solder ball

0.2

AB

M

(Datum B)

(Datum A)

87 654321

9

1.60

#A1 INDEX MARK

B

A

BOTTOM VIEW

J

K

L

(Post Reflow

∅0.50 ± 0.05)

1.40

± 0.10

#A1

8.00

± 0.10

0.35

± 0.05

TOP VIEW

A

B

C

D

E

F

G

H

M

N

3.20

0.80

78 -

∅0.45 Solder ball

0.2

AB

M

(Datum B)

(Datum A)

1.60

MOLDING AREA

#A1 INDEX MARK

B

BOTTOM VIEW

J

K

L

(Post Reflow

∅0.50 ± 0.05)

(0.95)

(1.90)

8765 4321

9

x 8 = 6.40

A

0.80

10.00

± 0.10

1.10

± 0.10

#A1

10.00

± 0.10

0.35

± 0.05

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K4B2G0446C Datasheet(PDF) 15 Page - Samsung semiconductor

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