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K4B2G0446C Datasheet(PDF) 8 Page - Samsung semiconductor |
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K4B2G0446C Datasheet(HTML) 8 Page - Samsung semiconductor |
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8 / 23 page  - 8 - Product Guide DDR3 SDRAM Memory May. 2010 4.6 240Pin DDR3 Registered DIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 240Pin DDR3 Registered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M393B2873EH1 YF8/H9 A(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M393B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M393B5673EH1 YF8/H9 B(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82 78 ball FBGA 30mm Now M393B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die M393B5670EH1 YF8/H9 C(1Rx4) 256M x 4 * 18 pcs 1Gb E-die 81 M393B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die M393B5773CH0 YF8/H9 A(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 512Mx 72 4GB M393B5173EH1 YF8 H(4Rx8) 128M x 8 * 36 pcs 1Gb E-die 84 78 ball FBGA 30mm Now M393B5173FH0 YF8/H9 128M x 8 * 36 pcs 1Gb F-die M393B5170EH1 YF8/H9 E(2Rx4) 256M x 4 * 36 pcs 1Gb E-die 82 M393B5170FH0 YF8/H9 256M x 4 * 36 pcs 1Gb F-die M393B5273BH1 YF8/H9 B(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82 M393B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die M393B5270BH1 YF8/H9 C(1Rx4) 512M x 4 * 18 pcs 2Gb B-die 81 M393B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die 1Gx 72 8GB M393B1G70EM1 YF8 F(4Rx4) DDP 512M x 4 * 36 pcs 1Gb E-die 8 4 78 ball FBGA 30mm Now M393B1K73BH1 YF8 H(4Rx8) 256M x 8 * 36 pcs 2Gb B-die 84 M393B1K73CH0 YF8/H9 256M x 8 * 36 pcs 2Gb C-die M393B1K70BH1 YF8/H9 E(2Rx4) 512M x 4 * 36 pcs 2Gb B-die 82 M393B1K70CH0 YF8/H9 512M x 4 * 36 pcs 2Gb C-die 2Gx 72 16GB M393B2K70BM1 YF8 F(4Rx4) DDP 1G x 4 * 36 pcs 2Gb B-die 84 78 ball FBGA 30mm Now M393B2K70CM0 YF8/H9 DDP 1G x 4 * 36 pcs 2Gb C-die M393B2G70AH0 YF8/H9 E(2Rx4) 1G x 4 * 36 pcs 4Gb A-die M393B2G73AH0 YF8/H9 H(4Rx8) 512M x 8 * 36 pcs 4Gb A-die 4Gx 72 32GB M393B4G70AH0 YF8/H9 AB(4Rx4) DDP 2G x 4 * 36 pcs 4Gb A-die 8 4 78 ball FBGA 30mm Now |
Similar Part No. - K4B2G0446C |
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Similar Description - K4B2G0446C |
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