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K4B2G0446C Datasheet(PDF) 5 Page - Samsung semiconductor |
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K4B2G0446C Datasheet(HTML) 5 Page - Samsung semiconductor |
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5 / 23 page  - 5 - Product Guide DDR3 SDRAM Memory May. 2010 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) * NOTE : K0(1600Mbps) will be available by ES level 4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) * NOTE : 1.35V product is 1.5V operatable. 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 64 1GB M378B2873EH1 CF8/H9 A(1Rx8) 128M x 8 * 8 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M378B2873FH0 CF8/H9/K0* 128M x 8 * 8 pcs 1Gb F-die 128Mx 72 1GB M391B2873EH1 CF8/H9 D(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M391B2873FH0 CF8/H9/K0* 128M x 8 * 9 pcs 1Gb F-die 256Mx 64 2GB M378B5673EH1 CF8/H9 B(2Rx8) 128M x 8 * 16 pcs 1Gb E-die 82 78 ball FBGA 30mm Now M378B5673FH0 CF8/H9/K0* 128M x 8 * 16 pcs 1Gb F-die M378B5773CH0 CF8/H9/K0* A(1Rx8) 256M x 8 * 8 pcs 2Gb C-die 8 1 256Mx 72 2GB M391B5673EH1 CF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 8 2 78 ball FBGA 30mm Now M391B5673FH0 CF8/H9/K0* 128M x 8 * 18 pcs 1Gb F-die M391B5773CH0 CF8/H9/K0* D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 1 512Mx 64 4GB M378B5273BH1 CF8/H9 B(2Rx8) 256M x 8 * 16 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M378B5273CH0 CF8/H9/K0* 256M x 8 * 16 pcs 2Gb C-die 512Mx 72 4GB M391B5273BH1 CF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M391B5273CH0 CF8/H9/K0* 256M x 8 * 18 pcs 2Gb C-die 1Gx 64 8GB M378B1G73AH0 CF8/H9/K0* B(2Rx8) 512M x 8 * 16 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now 1Gx 72 8GB M391B1G73AH0 CF8/H9/K0* E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now 240Pin DDR3 Unbuffered DIMM Org. Density Part Number Speed Raw Card Composition Comp. Version Internal Banks Rank PKG Height Avail. NOTE 128Mx 72 1GB M391B2873EH1 YF8/H9 D(1Rx8) 128M x 8 * 9 pcs 1Gb E-die 81 78 ball FBGA 30mm Now M391B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die 256Mx 72 2GB M391B5673EH1 YF8/H9 E(2Rx8) 128M x 8 * 18 pcs 1Gb E-die 82 78 ball FBGA 30mm Now M391B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die M391B5773CH0 YF8/H9 D(1Rx8) 256M x 8 * 9 pcs 2Gb C-die 8 1 512Mx 72 4GB M391B5273BH1 YF8/H9 E(2Rx8) 256M x 8 * 18 pcs 2Gb B-die 82 78 ball FBGA 30mm Now M391B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die 1Gx 72 8GB M391B1G73AH0 YF8/H9 E(2Rx8) 512M x 8 * 18 pcs 4Gb A-die 8 2 78 ball FBGA 30mm Now |
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