K4B2G0446C datasheet(4/23 Pages) SAMSUNG

Part #	K4B2G0446C

Description	DDR3 SDRAM Memory

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Manufacturer	SAMSUNG [Samsung semiconductor]

Direct Link	http://www.samsung.com/Products/Semiconductor

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Product Guide

DDR3 SDRAM Memory

May. 2010

3. DDR3 SDRAM Module Ordering Information

3 : DIMM

4 : SODIMM

Z

FBGA(Lead-free)

H

FBGA(Lead-free & Halogen-free)

J

FBGA(Lead-free, DDP)

M

FBGA(Lead-free & Halogen-free, DDP)

32 : 32M

33 : 32M (for 128Mb/512Mb)

64 : 64M

65 : 64M (for 128Mb/512Mb)

28 : 128M

29 : 128M (for 128Mb/512Mb)

56 : 256M

57 : 256M (for 512Mb/2Gb)

51 : 512M

52 : 512M (for 512Mb/2Gb)

1G : 1G

1K : 1G (for 2Gb)

2G : 2G

2K : 2G (for 2Gb)

M

1st Gen.

A

2nd Gen.

B

3rd Gen.

C

4th Gen.

D

5th Gen.

E

6th Gen.

F : 7th Gen.

G

8th Gen.

0 : None

2 : 2nd Rev.

4 : 4th Rev.

B : DDR3 SDRAM (1.5V VDD)

1. Memory Module : M

2. DIMM Type

3. Data Bits

4. DRAM Component Type

5. Depth

12. Speed

11. Temp & Power

10. PCB Revision

9. Package

8. Component Revision

7 : 8Banks & SSTL-1.5V

6. # of Banks in comp. & Interface

:

1 : 1st Rev.

3 : 3rd Rev.

S : Reduced Layer

C

Y

: Commercial Temp.( 0

°C ~ 85°C) & Normal Power

: Commercial Temp.( 0

°C ~ 85°C) & Low VDD(1.35V)

NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),

PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)

PCB Revision

Component Revision

# of Banks in Comp. & Interface

Depth

DRAM Component Type

Data bits

DIMM Type

Memory Module

Package

Temp & Power

Speed

M X X X B X X X X X X X - X X X

1

2

3

4

5

6

7

8

9

10

11

12

Bit Organization

0 : x 4

3 : x 8

4 : x16

7. Bit Organization

: DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)

: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)

: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)

: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)

F7

F8

H9

K0

71 : x64 204pin Unbuffered SODIMM

78 : x64 240pin Unbuffered DIMM

91 : x72 240pin ECC unbuffered DIMM

92 : x72 240pin VLP Registered DIMM

93 : x72 240pin Registered DIMM

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