SC16IS752 datasheet(52/59 Pages) NXP

Part #	SC16IS752

Description	Dual UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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52 / 59 page

SC16IS752_SC16IS762_7

Product data sheet

Rev. 07 — 19 May 2008

52 of 59

NXP Semiconductors

SC16IS752/SC16IS762

Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR

15. Package outline

Fig 37.

Package outline SOT361-1 (TSSOP28)

UNIT

A1

A2

A3

bp

cD (1)

E (2)

(1)

eHE

LLp

QZ

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

9.8

9.6

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.8

0.5

8

0

o

0.13

0.1

0.2

1

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT361-1

MO-153

99-12-27

03-02-19

0.25

w M

b p

Z

e

114

28

15

pin 1 index

θ

A

A1

A2

L p

Q

detail X

L

(A )

3

HE

E

c

v M A

X

A

D

y

0

2.5

5 mm

scale

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

A

max.

1.1

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SC16IS752 Datasheet(PDF) 52 Page - NXP Semiconductors

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