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ML483-G Datasheet(PDF) 6 Page - TriQuint Semiconductor |
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ML483-G Datasheet(HTML) 6 Page - TriQuint Semiconductor |
6 / 8 page ML483 0.7 – 1.0 GHz High IP3 Mixer with Integrated LO Amp Data Sheet: Rev C 03/23/10 - 6 of 8 - Disclaimer: Subject to change without noticee © 2010 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® Pin Description Pin Symbol Description 1 LO Local Oscillator (LO) Input. Internally matched to 50 . Internally DC blocked. External blocking not required. 2 GND Ground 3 GND Ground 4 Vcc Positive Supply Voltage. Requires capacitive decoupling at pin. 5 IF Intermediate Frequency (IF) Output. Internally matched to 50 . No Internal DC blocking. External blocking cap required if DC present. 6 GND Ground 7 GND Ground 8 RF RF Input. Internally matched to 50 . No Internal DC blocking. External blocking cap required if DC present. Backside Paddle Ground Applications Information PC Board Layout Top RF layer is .014” FR4, єr = 4.3, 4 total layers (0.062” thick) for mechanical rigidity. Metal layers are 1-oz copper. Microstrip line details: width = .026”, spacing = .026”. The ML483 application board is easy to use requiring only 1 external decoupling cap. This cap should be placed as close as possible to Vcc pin 4. All three ports use 50 microstrip. There are 5 grounding vias that are not shown. The backside paddle requires these 5 vias for good RF grounding. The mechanical configuration diagram on the next page illustrates proper placement of these vias. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. For further technical information, Refer to www.TriQuint.com 1 2 3 4 8 7 6 5 RF IF GND LO GND GND Vcc GND |
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