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004-04 / 20090305 / ef31_ccr.fm

• All specifications are subject to change without notice.

OSCILLATING FREQUENCY-TEMPERATURE

CHARACTERISTIC MEASURING CIRCUIT

MUC8/MXC8 TYPE 4.0 to 9.99MHz

MXC8 TYPE 10.0 to 11.0MHz

MXC7 TYPE 16.0 to 50.0MHz

MX7 TYPE 16.0 to 50.0MHz

MYC7 TYPE 24.0 to 50.0MHz

RELIABILITY AND TEST CONDITIONS

The following test items are satisfied.

(1) Oscillating frequency change: Within ±0.25%

(2) Resonant resistance change: Within ±10

Ω

(3) Appearance; serious abnormalities not to exist.

Vcc

Fosc

Vcc: 5V

Rf: 1M

Ω

IC: TC4089UBP(TOSHIBA)

Rf

Vcc

Fosc

Rf

Vcc: 5V

Rf: 1M

Ω

IC: TC74HCU04(TOSHIBA)

Rd: 220

Ω

Vcc

Fosc

Vcc: 5V

Rf: 1M

Ω

IC: TC74HCU04(TOSHIBA)

Rf

Vcc

Fosc

Vcc: 5V

Rf: 1M

Ω

IC: TC74HCU04 (TOSHIBA)

Rf

Vcc

Fosc

Rf

Vcc: 5V

Rf: 1M

Ω

IC: TC74HCU04(TOSHIBA)

Rd: 680

Ω

Test items

Test conditions

Low temperature storage

Temperature: –40±3°C

Time: 1000h

High temperature storage

Temperature: +85±2°C

Time: 1000h

Loading humidity resistance

Humidity: 90 to 95(%)RH

Temperature: 60±2°C

Time: 1000h

Thermal shock

–40°C (30min), 85°C (30min) x 100 cycles

Soldering heat resistance

Solder temperature: peak 260°C, 10s

reflow

Drop

Drop 3 times onto the concrete from a

height of 1m

Vibration

Frequency: 10

Amplitude: 1.5mm

X, Y and Z directions for 2h each

Board bend test

Solder this product onto a glass epoxy

board (L100

× W40× T1.6mm), press it by

up to 1mm in 1mm/s and keep it for 5sec.