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CDCE62005 Datasheet(PDF) 11 Page - Texas Instruments |
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CDCE62005 Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 80 page  CDCE62005 www.ti.com SCAS862C – NOVEMBER 2008 – REVISED FEBRUARY 2010 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VCC Supply voltage range(2) -0.5 to 4.6 V VI Input voltage range(3) –0.5 to VCC + 0.5 V VO Output voltage range(3) –0.5 to VCC + 0.5 V Input Current (VI < 0, VI > VCC) ±20 mA Output current for LVPECL/LVCMOS Outputs (0 < VO < VCC) ±50 mA TJ Maximum junction temperature 125 °C Tstg Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) All supply voltages have to be supplied simultaneously. (3) The input and output negative voltage ratings may be exceeded if the input and output clamp–current ratings are observed. THERMAL CHARACTERISTICS Package Thermal Resistance for QFN (RGZ) Package (1) (2) AIRFLOW (lfm) qJP (°C/W) (3) qJA (°C/W) 0 JEDEC Compliant Board (6X6 VIAs on PAD) 2 28.9 100 JEDEC Compliant Board (6X6 VIAs on PAD) 2 20.4 0 Recommended Layout (7X7 VIAs on PAD) 2 27.3 100 Recommended Layout (7X7 VIAs on PAD) 2 20.3 (1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (2) Connected to GND with 36 thermal vias (0,3 mm diameter). (3) qJP (Junction – Pad) is used for the QFN Package, because the main heat flow is from the Junction to the GND-Pad of the QFN. Copyright © 2008–2010, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s) :CDCE62005 |
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