VIN

CTRL

SW

FB

COMP

GND

TOP VIEW

Thermal

Pad

6-PIN2mmx2mmx0.8mmQFN

VIN

SW

FB

GND

CTRL

COMP

1

2

4

3

5

6

TOP VIEW

6-PINSOT-23

TPS61165

SLVS790A – NOVEMBER 2007 – REVISED MAY 2010

www.ti.com

ELECTRICAL CHARACTERISTICS (continued)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

High time high bit

Logic 1

360

ms

Low time high bit

Logic 1

2

180

ms

Acknowledge output voltage low

Open drain, Rpullup =15 k

Ω to VIN

0.4

V

Acknowledge valid time

2

ms

Duration of acknowledge condition

512

ms

THERMAL SHUTDOWN

Thermal shutdown threshold

160

°C

Thermal shutdown threshold hysteresis

15

°C

(2)

Acknowledge condition active 0, this condition will only be applied in case the RFA bit is set. Open drain output, line must be pulled high

by the host with resistor load.

DEVICE INFORMATION

PIN FUNCTIONS

PIN

I/O

DESCRIPTION

DRV

DBV

NAME

NO.

NO.

VIN

6

1

I

The input supply pin for the IC. Connect VIN to a supply voltage between 3V and 18V.

This is the switching node of the IC. Connect the switched side of the inductor to SW. This pin is also

SW

4

3

I

used to sense the output voltage for open LED protection.

GND

3

4

O

Ground

FB

1

6

I

Feedback pin for current. Connect the sense resistor from FB to GND.

Output of the transconductance error amplifier. Connect an external capacitor to this pin to

COMP

2

5

O

compensate the regulator.

Control pin of the boost regulator. It is a multi-functional pin which can be used for enable control,

CTRL

5

2

I

PWM and digital dimming.

Thermal

The thermal pad should be soldered to the analog ground plane. If possible, use thermal via to connect

Pad

to ground plane for ideal power dissipation.

4

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