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CDCLVP1212 Datasheet(PDF) 2 Page - Texas Instruments |
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CDCLVP1212 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 23 page CDCLVP1212 SCAS886A – AUGUST 2009 – REVISED MAY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS(1) TA PACKAGED DEVICES FEATURES CDCLVP1212RHAT 40-pin QFN (RHA) package, small tape and reel –40°C to +85°C CDCLVP1212RHAR 40-pin QFN (RHA) package, tape and reel (1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). CDCLVP1212 UNIT VCC Supply voltage range(2) –0.5 to 4.6 V VIN Input voltage range (3) –0.5 to VCC +0.5 V VOUT Output voltage range (3) –0.5 to VCC+0.5 V IIN Input current 20 mA IOUT Output current 50 mA TA Specified free-air temperature range (no airflow) –40 to +85 °C TSTG Storage temperature range –65 to +150 °C TJ Maximum junction temperature +125 °C ESD Electrostatic discharge (HBM) 2 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All supply voltages must be supplied simultaneously. (3) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). CDCLVP1212 PARAMETER MIN TYP MAX UNIT VCC Supply voltage 2.375 2.50/3.30 3.60 V TA Ambient temperature –40 +85 °C PACKAGE DISSIPATION RATINGS (1) (2) VALUE TEST 4 × 4 VIAS PARAMETER CONDITIONS ON PAD UNIT 0 LFM 36.1 °C/W qJA Thermal resistance, junction-to-ambient 150 LFM 30.2 °C/W 400 LFM 28.2 °C/W qJP (3) Thermal resistance, junction-to-pad 3.58 °C/W (1) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board). (2) Connected to GND with 16 thermal vias (0.3-mm diameter). (3) qJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN package. 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): CDCLVP1212 |
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