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CDCLVP1212 Datasheet(PDF) 2 Page - Texas Instruments

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Part # CDCLVP1212
Description  12 LVPECL Output, High-Performance Clock Buffer
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

CDCLVP1212 Datasheet(HTML) 2 Page - Texas Instruments

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CDCLVP1212
SCAS886A – AUGUST 2009 – REVISED MAY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS(1)
TA
PACKAGED DEVICES
FEATURES
CDCLVP1212RHAT
40-pin QFN (RHA) package, small tape and reel
–40°C to +85°C
CDCLVP1212RHAR
40-pin QFN (RHA) package, tape and reel
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or
refer to our web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
CDCLVP1212
UNIT
VCC
Supply voltage range(2)
–0.5 to 4.6
V
VIN
Input voltage range (3)
–0.5 to VCC +0.5
V
VOUT
Output voltage range (3)
–0.5 to VCC+0.5
V
IIN
Input current
20
mA
IOUT
Output current
50
mA
TA
Specified free-air temperature range (no airflow)
–40 to +85
°C
TSTG
Storage temperature range
–65 to +150
°C
TJ
Maximum junction temperature
+125
°C
ESD
Electrostatic discharge (HBM)
2
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All supply voltages must be supplied simultaneously.
(3)
The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
CDCLVP1212
PARAMETER
MIN
TYP
MAX
UNIT
VCC
Supply voltage
2.375
2.50/3.30
3.60
V
TA
Ambient temperature
–40
+85
°C
PACKAGE DISSIPATION RATINGS
(1) (2)
VALUE
TEST
4 × 4 VIAS
PARAMETER
CONDITIONS
ON PAD
UNIT
0 LFM
36.1
°C/W
qJA
Thermal resistance, junction-to-ambient
150 LFM
30.2
°C/W
400 LFM
28.2
°C/W
qJP
(3)
Thermal resistance, junction-to-pad
3.58
°C/W
(1)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board).
(2)
Connected to GND with 16 thermal vias (0.3-mm diameter).
(3)
qJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN
package.
2
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): CDCLVP1212


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