34

DS641F4

CS8421

6. PACKAGE DIMENSIONS

Notes:

1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold

mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per

side.

2. Dimension “b ” do es no t in clude d ambar pro trusion/intrusion. Allowabl e da mbar protrusion sha ll be

0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-

duce dimension “b” by more than 0.07 mm at least material condition.

3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

TSSOP THERMAL CHARACTERISTICS

INCHES

MILLIMETERS

NOTE

DIM

MIN

NOM

MAX

MIN

NOM

MAX

A

--

--

0.043

--

--

1.10

A1

0.002

0.004

0.006

0.05

--

0.15

A2

0.03346

0.0354

0.037

0.85

0.90

0.95

b

0.00748

0.0096

0.012

0.19

0.245

0.30

2,3

D

0.252

0.256

0.259

6.40

6.50

6.60

1

E

0.248

0.2519

0.256

6.30

6.40

6.50

E1

0.169

0.1732

0.177

4.30

4.40

4.50

1

e

--

--

0.026

--

--

0.65

L

0.020

0.024

0.028

0.50

0.60

0.70

µ

0°

4°

8°

0°

4°

8°

JEDEC #: MO-153

Controlling Dimension is Millimeters.

Parameter

Symbol

Min

Typ

Max

Units

Junction to Ambient Thermal Impedance

2 Layer Board

4 Layer Board

-

-

48

38

-

-

°C/Watt

°C/Watt

20L TSSOP (4.4 MM BODY) PACKAGE DRAWING

E

N

1 23

e

A1

A2

A

D

SEATING

PLANE

L

SIDE VIEW

END VIEW

TOP VIEW

∝