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HY27UF082G2B Datasheet(PDF) 20 Page - Hynix Semiconductor |
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HY27UF082G2B Datasheet(HTML) 20 Page - Hynix Semiconductor |
20 / 54 page Rev 0.2 / Jan. 2008 20 1 HY27UF(08/16)2G2B Series 2Gbit (256Mx8bit) NAND Flash Parameter Symbol Test Conditions 3.3Volt Unit Min Typ Max Operating Current Sequential Read ICC1 tRC=25ns CE=VIL, IOUT=0mA -15 30 mA Program ICC2 - - 15 30 mA Erase ICC3 - - 15 30 mA Stand-by Current (TTL) ICC4 CE=VIH, WP=0V/Vcc -1 mA Stand-by Current (CMOS) ICC5 CE=Vcc-0.2, WP=0V/Vcc -10 50 uA Input Leakage Current ILI VIN=0 to Vcc (max) - - ± 10 uA Output Leakage Current ILO VOUT =0 to Vcc (max) - - ± 10 uA Input High Voltage VIH - 0.8xVcc - Vcc+0.3 V Input Low Voltage VIL - -0.3 - 0.2xVcc V Output High Voltage Level VOH IOH=-400uA 2.4 - - V Output Low Voltage Level VOL IOL=2.1mA - - 0.4 V Output Low Current (R/B) IOL (R/B) VOL=0.4V 8 10 - mA Table 9: DC and Operating Characteristics Parameter Value 3.3Volt Input Pulse Levels 0V to VCC Input Rise and Fall Times 5ns Input and Output Timing Levels VCC/2 Output Load (2.7V - 3.6V) 1 TTL GATE and CL=50pF Table 10: AC Conditions |
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