LT6656



6656f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

S6 Package

6-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1636)

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45

6 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S6 TSOT-23 0302 REV B

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

package DescripTion

Typical applicaTions

Boosted Output Current Reference

C5

1µF

R5

220

6656 TA04

10µF

LT6656

3.6V TO 18V

40mA MAX

Q3

2N2905

+

Extended Supply Range Reference

UP TO 160V

C4

0.1µF

C3

1µF

Q2

MMBT5551

R4

4.7k

6656 TA03

LT6656

R3

330k

D1

BZX584C12