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SRGP400200 Datasheet(PDF) 3 Page - ALPS ELECTRIC CO.,LTD. |
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SRGP400200 Datasheet(HTML) 3 Page - ALPS ELECTRIC CO.,LTD. |
3 / 3 page ![]() Encoder Type Potentiometer Type 454 Hollow Shaft Type Devices Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 φ CA(K)or CC(T)at soldering portion(copper foil surface).A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 200 100 A max. B E D Time (s) C Room temperature Pre-heating F max. Series (Reflow type) SRGP30 240 260 230 20 150 150 120 SRGP40 40 180 A (℃) Max B (℃) C (s) D (℃) E (℃) F (s) 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. You are requested to verify the soldering conditions thoroughly beforehand. Notes Soldering Conditions Hollow Shaft Type Devices |
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