HSDL-3602 datasheet(15/27 Pages) LITEON

Part #	HSDL-3602

Description	IrDA짰 Data 1.4 Compliant 4 Mb/s 3V Infrared Transceiver

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Manufacturer	LITEON [Lite-On Technology Corporation]

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• Adjacent land keep-out is the maximum space oc-

cupied by the unit relative to the land pattern. There

should be no other SMD components within this

area.

• “h” is the minimum solder resist strip width required

to avoid solder bridging adjacent pads.

• It is recommended that 2 fiducial cross be placed at

mid-length of the pads for unit alignment.

Note : Wet/Liquid Photo-Imagineable solder resist/mask

is recommended.

1.2. Adjacent Land Keep-out and Solder Mask Areas

Dim.

mm

inches

h

min. 0.2

min. 0.008

j

13.4

0.528

k

4.7

0.185

l

3.2

0.126

Figure 3. HSDL-3602-007/-037 PCBA-Adjacent land keep-out and solder mask.

h

l

Rx LENS

Tx LENS

DIM.

mm

INCHES

h

j

k

l

MIN. 0.2

13.4

4.7

3.2

MIN. 0.008

0.528

0.185

0.126

j

SOLDER

MASK

LAND

k

• ADJACENT LAND KEEP-OUT IS THE

MAXIMUM SPACE OCCUPIED BY THE

UNIT RELATIVE TO THE LAND PATTERN.

THERE SHOULD BE NO OTHER SMD

COMPONENTS WITHIN THIS AREA.

• "h" IS THE MINIMUM SOLDER RESIST

STRIP WIDTH REQUIRED TO AVOID

SOLDER BRIDGING ADJACENT PADS.

• IT IS RECOMMENDED THAT 2 FIDUCIAL

CROSS BE PLACED AT MID-LENGTH OF

THE PADS FOR UNIT ALIGNMENT.

Y

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Manufacturer	Part #	Datasheet	Description
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