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MAX16068 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX16068 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 40 page 2 ______________________________________________________________________________________ 6-Channel, Flash-Configurable System Manager with Nonvolatile Fault Registers Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VCC to GND...............……………………………….-0.3V to +15V MON_, SCL, SDA, A0 to GND ................................-0.3V to +6V EN, TCK, TMS, TDI to GND ....................................-0.3V to +4V TDO to GND............................................-0.3V to (VDBP + 0.3V) RESET, GPIO_ (configured as open-drain) to GND.....................-0.3V to +6V RESET, GPIO_ (configured as push-pull) to GND .................................................-0.3V to (VDBP + 0.3V) DBP, ABP to GND .......................................-0.3V to minimum of (4V and (VCC + 0.3V)) Continuous Current (all pins) .......................................... Q20mA Continuous Power Dissipation (TA = +70NC) 28-Pin TQFN (derate 34.5mW/NC above +70NC)..... 2759mW* Thermal Resistance (Note 1) B JA................................................................................29NC/W B JC ........................…………………………….………… 2NC/W Operating Temperature Range.......................... -40NC to +85NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC ELECTRICAL CHARACTERISTICS (VCC = 2.8V to 14V, TA = TJ = -40NC to +85NC, unless otherwise specified. Typical values are at VABP = VDBP = VCC = 3.3V, TA = +25NC.) (Note 2) ABSOLUTE MAXIMUM RATINGS *As per JEDEC 51 Standard, Multilayer Board (PCB). Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Voltage Range VCC RESET output asserted low 1.2 V 2.8 14 Undervoltage Lockout VUVLO Minimum voltage on VCC to ensure the device is flash configurable 2.7 V Undervoltage Lockout Hysteresis UVLOHYS 55 mV Minimum Flash Operating Voltage VFLASH Minimum voltage on VCC to ensure flash erase and write operations 2.7 V Supply Current ICC1 No load on any output 2.8 4 mA ICC2 No load on any output, during flash writing cycle 7.7 14 VCC = VABP = VDBP = 3.6V (Note 3) 5 DBP Regulator Voltage VDBP VCC = 5V, CDBP = 1FF, no load 2.8 3 3.2 V ABP Regulator Voltage VABP VCC = 5V, CABP = 1FF, no load 2.85 3 3.15 V Boot Time tBOOT VCC > VUVLO 100 200 F s Flash Writing Time 8-byte word 122 ms Internal Timing Accuracy (Note 4) -10 +10 % ADC Resolution 10 Bits Gain Error ADCGAIN TA = +25NC 0.35 % TA = -40NC to +85NC 0.75 Offset Error ADCOFF 1.5 LSB |
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