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MCP1631T-E/SS Datasheet(PDF) 8 Page - Microchip Technology |
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MCP1631T-E/SS Datasheet(HTML) 8 Page - Microchip Technology |
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8 / 34 page  MCP1631/HV/MCP1631V/VHV DS22063B-page 8 © 2008 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Line Regulation ΔVOUT/ (VOUTXΔ VIN) -0.3 ±0.1 +0.3 %/V (VOUT(MAX) + VDROPOUT(MAX)) ≤ VIN ≤ 16V Note 2 Load Regulation ΔVOUT/ VOUT -2.5 ±1.0 +2.5 % IL = 1.0 mA to 250 mA, Note 4 Dropout Voltage Note 2, Note 5 VDROPOUT — 330 650 mV IL = 250 mA, VR = 5.0V — 525 725 mV IL = 250 mA, VR = 3.3V Output Delay Time TDELAY — 1000 — µs VIN = 0V to 6V, VOUT = 90% VR, RL = 50Ω resistive Output Noise eN —8 — µV/ (Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1µF Power Supply Ripple Rejection Ratio PSRR — 44 — dB f = 100 Hz, COUT = 1 µF, IL = 100 µA, VINAC =100 mV pk-pk, CIN = 0 µF, VR =1.2V Protection Features Thermal Shutdown TSHD — 150 — °C Thermal Shutdown Hysteresis TSHD_HYS —18 — °C Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 3.0V to 5.5V Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Junction Temperature Range TJ -40 — +125 °C Steady State Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Transient Package Thermal Resistances Thermal Resistance, 20L-TSSOP θJA — 90 — °C/W Typical 4 Layer board with interconnecting vias Thermal Resistance, 20L-SSOP θJA — 89.3 — °C/W Typical 4 Layer board with interconnecting vias Thermal Resistance, 20L-QFN θJA — 43 — °C/W Typical 4 Layer board with interconnecting vias DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VDD for typical values = 5.0V, TA for typical values = +25°C, TA = -40°C to +125°C for all minimum and maximums. Parameters Sym Min Typ Max Units Conditions Note 1: External Oscillator Input (OSCIN) rise and fall times between 10 ns and 10 µs were determined during device characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum values. Not production tested. Additional timing specifications were fully characterized and specified that are not production tested. 2: The minimum VIN must meet two conditions: VIN ≥ 3.5V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)). 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 3.5V, whichever is greater. |
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