© 2009 Microchip Technology Inc.

DS21974B-page 7

TC1313

TEMPERATURE SPECIFICATIONS

Output Short Circuit Current

(Average)

—

240

—

mA

Wake-Up Time

—31

100

µs

Settling Time

—

100

—

µs

Electrical Specifications:

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

-40

—

+125

°C

Steady state

Storage Temperature Range

-65

—

+150

°C

Maximum Junction Temperature

—

—

+150

°C

Transient

Thermal Package Resistances

Thermal Resistance, 10L-DFN

—

41

—

°C/W

Typical 4-layer board with Internal

Ground Plane and 2 Vias in Thermal

Pad

Thermal Resistance, 10L-MSOP

—

113

—

°C/W

Typical 4-layer board with Internal

Ground Plane

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

1:

2:

3:

4:

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current.

5:

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value measured at a 1V differential.

6:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation causes the device to initiate thermal shutdown.

7:

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to limit the junction temperature for these cases.

8: