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RGT2-30001002G Datasheet(PDF) 1 Page - IRC - a TT electronics Company. |
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RGT2-30001002G Datasheet(HTML) 1 Page - IRC - a TT electronics Company. |
1 / 3 page General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of TT electronics plc • 4222 South Staples Street • Corpus Christi Texas 78411 USA Wire and Film Technologies Division Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com RGT Series • Superior linearity • Stable thick-film technology • Negative temperature coefficient • Effective compensation for positive TC devices, semiconductors, and copper Thick Film Temperature Compensation Resistor Specifications Temperature Coefficient Resistance Ratio Linearity Standard Resistance Values Std. Resistance Tol. @ 25°C -0.30%/°C (minus 3000 ppm/°C @ 25°C) R25°C/R125°C = 1.37 <1.2% deviation per 100°C (typical over range from -55°C to 140°C) 740, 1K and 10K. Others available ±2%, ±5%, ±10% Operating Temperature Range High Temp Stability Time Constraints Dissipation Constants Element -55°C to + 175°C 2000 hours @ 175°C, <0.5% ∆R 7.4 sec for RGT-1, 2.9 sec. for RGT-2 (time to achieve 63.2% of an applied step-change in temperature in still air) 8.1mW/°C for RGT-1, 4.7mW°C for RGT-2 (power required to raise sensor temperature 1°C in a still air ambient of 25°C) fused thick-film composition Substrate Lead Pull Resistance to Soldering Heat Marking Resistance to Solvents Lead Solderability solid-core alumina ceramic 5 lbs for 5 sec. MIL-STD-202E, Method 210A, cond. A, <0.5% ∆R MIL-STD-202, Method 215 MIL-STD-202, Method 208 Temperature G Tol. J Tol. K Tol. -55°C -15°C 0°C 25°C 50°C 75°C 100°C 125°C 150°C 175°C -67°F +9°F +32°F 77°F 122°F 167°F 212°F 257°F 302°F 347°F 7% 4.5% 3.6% ±2% 2.5% 3.0% 3.5% 4.0% 4.5% 5.0% 10% 7.5% 6.6% ±5% 5.5% 6.0% 6.5% 7.0% 7.5% 8.0% 15% 12.5% 11.6% ±10% 10.5% 11.0% 11.5% 12.0% 12.5% 13.0% Applications Curve Tolerances (±) Compensates transistors, diodes, sensors, transducers, hall devices, microprocessors, and strain gauges. Proven in automotive under-hood use. Exclusive thick film process results in a very linear, negative, 3000 ppm/°C resistance temperature characteristic Digital Marking High conductivity plate-on nickel termination Tin-lead electroplated copper leads Heat conducting ceramic substrate RGT Series Issue December 2008 Sheet 1 of 3 |
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