13

5194F–SEEPR–1/08

AT24C1024B

Notes: 1. “-B” denotes bulk

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.

3. Available in tape and reel and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.

Please contact Serial Interface Marketing.

Ordering Information

Ordering Code

Voltage

Package

Operation Range

AT24C1024B-PU (Bulk form only)

1.8

8P3

Lead-free/Halogen-free/

Industrial Temperature

(–40

°C to 85°C)

AT24C1024B-PU25 (Bulk form only)

2.5

8P3

1.8

8S1

1.8

8S1

2.5

8S1

2.5

8S1

1.8

8S2

1.8

8S2

2.5

8S2

2.5

8S2

1.8

8A2

1.8

8A2

2.5

8A2

2.5

8A2

1.8

8Y7

2.5

8Y7

1.8

8U4-1

1.8

Die Sale

Industrial Temperature

(–40

°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)

8S1

8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)

8S2

8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y7

8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)

8U4-1

8-ball, die Ball Grid Array Package (dBGA2)

Options

–1.8

Low-voltage (1.8V to 3.6V)

–2.5

Low-voltage (2.5V to 5.5V)