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TS3USB221ARSERG4 Datasheet(PDF) 1 Page - Texas Instruments |
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TS3USB221ARSERG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page 1 FEATURES 1 10 2 9 3 8 4 7 V CC S D+ D– OE 1D+ 1D– 2D+ 2D– GND 5 6 APPLICATIONS DESCRIPTION 1 10 2 9 3 8 4 7 V CC S D+ D– OE 1D+ 1D– 2D+ 2D– GND 5 6 TS3USB221A www.ti.com .......................................................................................................................................................................................... SCDS277 – NOVEMBER 2008 ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE RSE PACKAGE • V CC Operation at 2.5 V to 3.3 V (TOP VIEW) • V I/O Accepts Signals Up to 5.5 V • 1.8-V Compatible Control-Pin Inputs • Low-Power Mode When OE Is Disabled (1 µA) • r ON = 6 Ω Maximum • Δr ON = 0.2 Ω Typical • C io(on) = 6 pF Typical • Low Power Consumption (30 µA Maximum) • High Bandwidth (900 MHz Typical) • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Performance Tested Per JESD 22 RSE PACKAGE – 7000-V Human-Body Model (BOTTOM VIEW) (A114-B, Class II) – 1000-V Charged-Device Model (C101) • ESD Performance I/O to GND – 12-kV Human-Body Model • Routes Signals for USB 1.0, 1.1, and 2.0 The TS3USB221A is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). The TS3USB221A integrates ESD protection cells on all pins, is available in a tiny µQFN package (2.0 mm × 1.5 mm) and is charaterized over the free air temperature range from –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2008, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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