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Available on Tape and

Reel for Pick and Place

Manufacturing.

Model BD2326L50200A00

Rev C

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical

and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/

An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased

footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique

dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances.

No Bias Footprint

.012

[0.31]

2X .006

[0.16]

6X .013

[0.34]

6X .011

[0.29]

6X .002

[0.05]

3X Transmission

Line

Plated thru

holes to

ground

Part Orientation (Top View)

0603 Standaard Mounting Footprint

Dimensions are in Inches [Millimeters]

Circuit Pattern

Footprint Pad (s)

Solder Resist

DC Bias Footprint

0603 DC Bias Mounting Footprint

Dimensions are in Inches [Millimeters]

Circuit Pattern

Footprint Pad (s)

Solder Resist

.012

[0.31]

6X .011

[0.29]

6X .002

[0.05]

3X Transmission

Line

Plated thru

holes to

ground

Part Orientation (Top View)

DC Bias

6X .013

[0.34]

2X .006

[0.16]