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EMP216MGAW Datasheet(PDF) 3 Page - Emerging Memory & Logic Solutions Inc |
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EMP216MGAW Datasheet(HTML) 3 Page - Emerging Memory & Logic Solutions Inc |
3 / 12 page EMP216MGAW Series 2Mx16 Pseudo Static RAM Preliminary Rev 0.0 GENERAL WAFER SPECIFICATIONS - Process Technology : 0.125um CMOS Deep trench process - 3 Metal layers including local inter-connection - Wafer thickness : 725 +/- 25um - Wafer Diameter : 8-inch 2Mb x16 Pseudo Static RAM PAD DESCRIPTION Name Function Name Function CS# Chip select inputs LB# Lower byte (DQ0~7) OE# Output enable input UB# Upper byte (DQ8~15) WE# Write enable input VCC Power supply ZZ# Low Power Control VCCQ I/O Power supply DQ0-15 Data In-out VSS(Q) Ground A0-20 Address inputs NC No connection |
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