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STK14C88-3 Datasheet(PDF) 18 Page - Simtek Corporation |
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STK14C88-3 Datasheet(HTML) 18 Page - Simtek Corporation |
18 / 18 page 18 Feb, 2008 Document Control #ML0015 Rev 2.0 STK14C88-3 Document Revision History SIMTEK STK14C88-3 Datasheet, February 2008 Copyright 2008, Simtek Corporation. All rights reserved. This datasheet may only be printed for the expressed use of Simtek Customers. No part of the datasheet may be reproduced in any other form or means without the express written permission from Simtek Corporation. The information contained in this publication is believed to be accurate, but changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including MER- CHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use. Nothing herein constitutes a license, grant or transfer of any rights to any Simtek patent, copyright, trademark, or other proprietary right. Revision Date Summary 0.0 January 2003 Added 35 nsec device; added HSB operation; current limiting resistor added to Vcc for extreme power-off slew rate 0.1 February 2003 Added 48 SSOP package 0.2 September 2003 Added lead-free lead finish 0.3 November 2003 Modified pin assignments on 48 SSOP package 0.4 January 2006 Removed 48 pin SSOP package. Removed 55 ns product offering. Added previously unspecified NVC and DATAR specifications to DC Characteristics. 0.5 March 2006 Removed Leaded Lead Finish 0.6 February 2007 Add Tape Reel Ordering Options Add Product Ordering Code Listing Add Package Drawings Reformat Entire Document 0.7 July 2007 extend definition of tHZ (#7) update fig. SRAM READ CYCLE #2, SRAM WRITE CYCLE #1, Note r, Note u and Note v to clarify product usage 2.0 February 2008 Page 1: in the block diagram and elsewhere in the document, removed the “x” from Vccx. Page 3: added thermal characteristics. Page 4: in Note g below the SRAM Read Cycles #1 and #2 table, revised note g by deleting “and low during SRAM WRITE cycles; in SRAM Read Cycles #1 & #2 table, revised descrip- tion for tELQX; changed Symbol #2 to t ELEH for Read Cycle Time; updated SRAM Read Cycle #2 timing diagram; and changed title to add G controlled. Page 7: in Hardware Store Cycle table, removed footnote i for notes 22 and 23. Page 8: in Software Store/Recall Mode Selection table, added footnote n to both rows. Page 11: under HSB Operation, revised first paragraph to read “The HSB pin has a very resistive pullup...” Page 12: added best practices section. Page 15: added access times column to the Ordering codes. |
Similar Part No. - STK14C88-3_08 |
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Similar Description - STK14C88-3_08 |
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