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M58CR032C Datasheet(PDF) 46 Page - STMicroelectronics |
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M58CR032C Datasheet(HTML) 46 Page - STMicroelectronics |
46 / 63 page M58CR032C, M58CR032D 46/63 PART NUMBERING Table 27. Ordering Information Scheme Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc....) or for further information on any aspect of this de- vice, please contact the ST Sales Office nearest to you. Example: M58CR032C 85 ZB 6 T Device Type M58 Architecture C = Dual Bank, Burst Mode Operating Voltage R = VDD = 1.65V to 2.0V, VDDQ = 1.65V to 3.3V Device Function 032C = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot 032D = 32 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot Speed 85 = 85 ns 100 = 100 ns 120 = 120 ns Package ZB = TFBGA56: 0.75 mm pitch Temperature Range 6 = –40 to 85°C Option T = Tape & Reel packing |
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