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M27C256B Datasheet(PDF) 6 Page - STMicroelectronics |
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M27C256B Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 16 page  M27C256B 6/16 Figure 5. Read Mode AC Waveforms AI00758B tAXQX tEHQZ A0-A14 E G Q0-Q7 tAVQV tGHQZ tGLQV tELQV VALID Hi-Z VALID Table 8B. Read Mode AC Characteristics (1) (TA = 0 to 70°C, –40 to 85°C, –40 to 105°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC) Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Sampled only, not 100% tested. Symbol Alt Parameter Test Condition M27C256B Unit -90 -10 -12 -15/-20/-25 Min Max Min Max Min Max Min Max tAVQV tACC Address Valid to Output Valid E = VIL, G = VIL 90 100 120 150 ns tELQV tCE Chip Enable Low to Output Valid G = VIL 90 100 120 150 ns tGLQV tOE Output Enable Low to Output Valid E = VIL 40 50 60 65 ns tEHQZ (2) tDF Chip Enable High to Output Hi-Z G = VIL 0 300 30 040 0 50 ns tGHQZ (2) tDF Output Enable High to Output Hi-Z E = VIL 0 300 30 040 0 50 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0000 ns System Considerations The power switching characteristics of Advance CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three seg- ments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceram- ic capacitor be used on every device between VCC and VSS. This should be a high frequency capaci- tor of low inherent inductance and should be placed as close to the device as possible. In addi- tion, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devic- es. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. |
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