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M36L0T7050T2 Datasheet(PDF) 20 Page - Numonyx B.V |
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M36L0T7050T2 Datasheet(HTML) 20 Page - Numonyx B.V |
20 / 22 page Part numbering M36L0T7050T2, M36L0T7050B2 20/22 7 Part numbering Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the Numonyx Sales Office nearest to you. Table 7. Ordering information scheme Example: M36 L 0 T 7 0 5 0 T 2 ZAQ F Device Type M36 = Multi-Chip Package (Flash + RAM) Flash 1 Architecture L = Multilevel, Multiple Bank, Burst mode Flash 2 Architecture 0 = No Die Operating Voltage T = VDDF = 1.7 to 1.95V; VDDQ = VCCP = 2.7 to 3.1V Flash 1 Density 7 = 128 Mbit Flash 2 Density 0 = No Die RAM 1 Density 5 = 32 Mbit RAM 0 Density 0 = No Die Parameter Blocks Location T = Top Boot Block Flash B = Bottom Boot Block Flash Product Version 2 = 90nm Flash technology and Multi-Level design, 85ns speed; 0.13µm RAM, 65ns speed Package ZAQ = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch Option Blank = Standard Packing T = Tape & Reel Packing E = ECOPACK® package, standard packing F = ECOPACK® package, tape and reel packing |
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