CY7C1444AV25
CY7C1445AV25
Document #: 38-05351 Rev. *E
Page 26 of 26
Document History Page
Document Title: CY7C1444AV25/CY7C1445AV25 36-Mbit (1M x 36/2M x 18) Pipelined DCD Sync SRAM
Document Number: 38-05351
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
124418
03/04/03
CGM
New data sheet
*A
254909
See ECN
SYT
Part number changed from previous revision. New and old part number differ by
the letter “A”
Modified Functional Block diagrams
Modified switching waveforms
Added Boundary scan information
Added IDD, IX and ISB values in the DC Electrical Characteristics
Added tPOWER specifications in Switching Characteristics table
Removed 119 PBGA package
Edited Ordering Information typo for 165-ball FBGA part and package name
*B
303533
See ECN
SYT
Changed the test condition from VDD = Min to VDD = Max for VOL in the Electrical
Characteristics table
Replaced
Θ
JA and ΘJC from TBD to respective Thermal Values for All Packages
on the Thermal Resistance Table
Changed IDD from 450, 400 & 350 mA to 435, 385 & 335 mA for 250, 200 and 167
Mhz respectively
Changed ISB1 from 190, 180 and 170 mA to 185 mA for 250, 200 and 167 MHz
respectively
Changed ISB2 from 80 mA to 100 mA for all frequencies
Changed ISB3 from 180, 170 & 160 mA to 160 mA for 250, 200 and 167 MHz
respectively
Changed ISB4 from 100 mA to 110 mA for all frequencies
Changed CIN, CCLK and CI/O from 5, 5 and 7 pF to 6.5, 3 and 5.5 pF respectively
for TQFP Package
Changed tCO from 3.0 to 3.2 ns and tDOH from 1.3 ns to 1.5 ns for 200 MHz Speed
Bin
Added lead-free information for 100-pin TQFP and 165 FBGA packages
*C
331778
See ECN
SYT
Modified Address Expansion balls in the pinouts for 165 FBGA Package as per
JEDEC standards and updated the Pin Definitions accordingly
Modified VOL, VOH test conditions
Changed CIN, CCLK and CI/O to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA
Package
Added Industrial Temperature Grade
Changed ISB2 and ISB4 from 100 and 110 mA to 120 and 135 mA respectively
Updated the Ordering Information by Shading and Unshading MPNs as per avail-
ability
*D
417509
See ECN
RXU
Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901
North First Street” to “198 Champion Court”
Changed IX current value in MODE from –5 & 30 µA to –30 & 5 µA respectively
and also Changed IX current value in ZZ from –30 & 5 µA to –5 & 30 µA respectively
on page# 16
Modified test condition from VIH < VDD to VIH < VDD
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the
Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering
Information table
Replaced Package Diagram of 51-85050 from *A to *B
*E
473229
See ECN
VKN
Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND.
Changed tTH, tTL from 25 ns to 20 ns and tTDOV from 5 ns to 10 ns in TAP AC
Switching Characteristics table.
Updated the Ordering Information table.
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