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CY7C1444AV25
CY7C1445AV25
Document #: 38-05351 Rev. *E
Page 17 of 26
Capacitance[16]
Parameter
Description
Test Conditions
100 TQFP
Max.
165 FBGA
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VDD/VDDQ = 2.5V
6.5
7
pF
CCLK
Clock Input Capacitance
3
7
pF
CI/O
Input/Output Capacitance
5.5
6
pF
Thermal Resistance[16]
Parameter
Description
Test Conditions
100 TQFP
Package
165 FBGA
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
25.21
20.8
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
2.28
3.2
°C/W
AC Test Loads and Waveforms
Note:
16. Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 1667
Ω
R = 1538
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VT = 1.25V
2.5V
ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
2.5V I/O Test Load
OUTPUT
R = 14K
Ω
R = 14K
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VT = 1.25V
1.8V
(c)
1.8V I/O Test Load
VDDQ-0.2
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
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